High Impact Solder Toughness Alloy
A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag. |
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