LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

A light-emitting diode (LED) package includes an LED chip, a phosphor film adhered to a top surface of the LED chip, and a molding phosphor covering a side surface of the LED chip.

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Bibliographische Detailangaben
Hauptverfasser: JEONG Song-ho, KIM Choo-ho, PARK HUN-YONG, LIM Jong-ho
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A light-emitting diode (LED) package includes an LED chip, a phosphor film adhered to a top surface of the LED chip, and a molding phosphor covering a side surface of the LED chip.