HEAT SINK AND ELECTRONIC APPARATUS

A heat sink includes: a base sheet metal having a flat plate shape; and a radiation fin bonded to a first surface of the base sheet metal, wherein the radiation fin includes: a bonding plate portion having a flat plate shape, and superposed on and bonded to the first surface of the base sheet metal;...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA Hiroshi, SHOJI Hiromu
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A heat sink includes: a base sheet metal having a flat plate shape; and a radiation fin bonded to a first surface of the base sheet metal, wherein the radiation fin includes: a bonding plate portion having a flat plate shape, and superposed on and bonded to the first surface of the base sheet metal; and a fin member installed upright with respect to the bonding plate portion, and wherein the base sheet metal and the bonding plate portion are bonded to each other by fitting a convex portion, which is formed on one of the base sheet metal and the bonding plate portion, into a concave portion formed on a remaining one thereof through half-punch working,