EPOXY RESIN COMPOSITION AND CURED PRODUCT OF SAME

The present invention relates to an epoxy resin composition containing an alicyclic epoxy compound (A), a polymer polyol having two or more terminal hydroxyl groups (B), and a Lewis acid-amine complex (C). The present invention provides an epoxy resin composition which can be cured by heating at low...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KOBATAKE Takanori
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to an epoxy resin composition containing an alicyclic epoxy compound (A), a polymer polyol having two or more terminal hydroxyl groups (B), and a Lewis acid-amine complex (C). The present invention provides an epoxy resin composition which can be cured by heating at low temperatures, and suppresses heat generation associated with curing (heat generation by curing). It is preferable that the epoxy resin composition further contains an antioxidant. Furthermore, it is preferable that the antioxidant is a phosphite ester compound.