MODULAR SYSTEM LAYOUT UTILIZING THREE-DIMENSIONS

A semiconductor processing system may be provided that includes a first plurality of semiconductor processing tools with a first average wafer transfer plane and a second plurality of semiconductor processing tools with a second average wafer transfer plane. The second plurality of semiconductor pro...

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Bibliographische Detailangaben
Hauptverfasser:	van Gogh James Stephen, Gould Richard Howard, Salek Mohsen, Kristoffersen Candi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor processing system may be provided that includes a first plurality of semiconductor processing tools with a first average wafer transfer plane and a second plurality of semiconductor processing tools with a second average wafer transfer plane. The second plurality of semiconductor processing tools may be vertically offset from the first plurality of semiconductor processing tools by a first vertical distance measured between the first average wafer transfer plane and the second average wafer transfer plane, and the first and second pluralities of semiconductor processing tools are in a commonly shared space.