SEMICONDUCTOR DEVICE, LEAD FRAME, AND METHOD OF MANUFACTURING LEAD FRAME

Provided is a lead frame that may prevent resin cracks from occurring in a semiconductor device. When a lead frame (3) is formed through press working, punching burrs (3d) are formed on tips of inner leads (3b) to serve as anchors with respect to a resin (5). The punching burrs (3d) are acute-angled...

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Bibliographische Detailangaben
1. Verfasser:	ITO Mami
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Provided is a lead frame that may prevent resin cracks from occurring in a semiconductor device. When a lead frame (3) is formed through press working, punching burrs (3d) are formed on tips of inner leads (3b) to serve as anchors with respect to a resin (5). The punching burrs (3d) are acute-angled projecting portions formed in a direction of a bottom surface of the semiconductor device.