MODULAR THERMAL SOLUTION FOR HIGH-PERFORMANCE PROCESSORS

Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating comp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Jaggers Christopher, Janak Chris, Merrikh Ali Akbar
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.