FABRICATION METHODOLOGY FOR THIN FILM LITHIUM ION DEVICES

A method of making multilayer thin film Li-ion devices that can involve direct current (DC) sputtering of a metal current collector film or pulsed DC sputtering (PDC) of a transparent conducting oxide (TCO) onto a substrate, depositing a very thin metal diffusion barrier using high power impulse mag...

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Bibliographische Detailangaben
Hauptverfasser:	Gittleman Bruce D, Alie David
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY FREQUENCY-CHANGING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	A method of making multilayer thin film Li-ion devices that can involve direct current (DC) sputtering of a metal current collector film or pulsed DC sputtering (PDC) of a transparent conducting oxide (TCO) onto a substrate, depositing a very thin metal diffusion barrier using high power impulse magnetron sputtering (HPIMS), depositing one or more ion storage layers or a cathode layer and an electrolyte layer by PDC sputtering or reactive PDC sputtering of a non-insulating target, and depositing a TCO via PDC sputtering or depositing an anode layer by PDC sputtering and a metal current collector by DC sputtering, the combination of these layers depending on the particular device being fabricated.