PRINTED CIRCUIT BOARD ASSEMBLY HAVING A DAMPING LAYER

A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Li Gemin, Bard Benjamin A, Mead Curtis C, Poulain Kieran, Gong Zhong-Qing, Richardson Kevin R, Martinez Paul, Duke Connor R, Kottke Nelson J, Yoo Sung Woo
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.