PACKAGING STRUCTURE OF A MICROELECTRONIC DEVICE HAVING A HERMETICITY IMPROVED BY A DIFFUSION BARRIER LAYER
A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed; several separated portions of metallic material suc...
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creator | DEN DEKKER Arnoldus GIESEN Marcel PORNIN Jean-Louis REIG Bruno SAINT-PATRICE Damien HENN Gudrun |
description | A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed; several separated portions of metallic material such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes; at least one diffusion barrier layer comprising at least one non-metallic material, arranged on the cap layer and forming a diffusion barrier against an atmosphere outside the cavity at least around the release holes; and wherein parts of the diffusion barrier layer are not covered by the portions of metallic material. |
format | Patent |
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GIESEN Marcel ; PORNIN Jean-Louis ; REIG Bruno ; SAINT-PATRICE Damien ; HENN Gudrun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017057809A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>ELECTRICITY</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>DEN DEKKER Arnoldus</creatorcontrib><creatorcontrib>GIESEN Marcel</creatorcontrib><creatorcontrib>PORNIN Jean-Louis</creatorcontrib><creatorcontrib>REIG Bruno</creatorcontrib><creatorcontrib>SAINT-PATRICE Damien</creatorcontrib><creatorcontrib>HENN Gudrun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DEN DEKKER Arnoldus</au><au>GIESEN Marcel</au><au>PORNIN Jean-Louis</au><au>REIG Bruno</au><au>SAINT-PATRICE Damien</au><au>HENN Gudrun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PACKAGING STRUCTURE OF A MICROELECTRONIC DEVICE HAVING A HERMETICITY IMPROVED BY A DIFFUSION BARRIER LAYER</title><date>2017-03-02</date><risdate>2017</risdate><abstract>A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed; several separated portions of metallic material such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes; at least one diffusion barrier layer comprising at least one non-metallic material, arranged on the cap layer and forming a diffusion barrier against an atmosphere outside the cavity at least around the release holes; and wherein parts of the diffusion barrier layer are not covered by the portions of metallic material.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING |
title | PACKAGING STRUCTURE OF A MICROELECTRONIC DEVICE HAVING A HERMETICITY IMPROVED BY A DIFFUSION BARRIER LAYER |
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