PACKAGING STRUCTURE OF A MICROELECTRONIC DEVICE HAVING A HERMETICITY IMPROVED BY A DIFFUSION BARRIER LAYER

PACKAGING STRUCTURE OF A MICROELECTRONIC DEVICE HAVING A HERMETICITY IMPROVED BY A DIFFUSION BARRIER LAYER

A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed; several separated portions of metallic material suc...

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Bibliographische Detailangaben
Hauptverfasser: DEN DEKKER Arnoldus, GIESEN Marcel, PORNIN Jean-Louis, REIG Bruno, SAINT-PATRICE Damien, HENN Gudrun
Format: Patent
Sprache:eng
Schlagworte:
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Beschreibung
Zusammenfassung:A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed; several separated portions of metallic material such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes; at least one diffusion barrier layer comprising at least one non-metallic material, arranged on the cap layer and forming a diffusion barrier against an atmosphere outside the cavity at least around the release holes; and wherein parts of the diffusion barrier layer are not covered by the portions of metallic material.