SEMICONDUCTOR DEVICE WITH TRENCH-LIKE FEED-THROUGHS

A semiconductor device (e.g., a flip chip) includes a substrate layer that is separated from a drain contact by an intervening layer. Trench-like feed-through elements that pass through the intervening layer are used to electrically connect the drain contact and the substrate layer when the device i...

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Bibliographische Detailangaben
Hauptverfasser:	Kasem Mohammed, Xu Robert, Chen Qufei, Katraro Reuven, Chen Kuo-In, Choi Calvin, Wong Ronald, Terrill Kyle, Pattanayak Deva, Lui Kam Hong, Owyang King
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device (e.g., a flip chip) includes a substrate layer that is separated from a drain contact by an intervening layer. Trench-like feed-through elements that pass through the intervening layer are used to electrically connect the drain contact and the substrate layer when the device is operated.