SEMICONDUCTOR DEVICES HAVING METAL BUMPS WITH FLANGE

A semiconductor device having a terminal site (100) including a flat pad (110) of a first metal covered by a layer (130) of dielectric material, the layer over the pad parallel to the pad and having a window of a first diameter (132) exposing the surface of the underlying pad. The terminal site furt...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Camenforte, III Floro Lopez, Clarina, JR. Armando Tresvalles, Baello James Raymond Maliclic
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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