SILVER PASTE AND ITS USE IN SEMICONDUCTOR DEVICES

The composition of an electrode thick film paste used in forming electrical contacts with silicon solar cells is disclosed. The thick film paste is comprised of an electrically conductive metal, an organic vehicle system and a system of inorganic additives. The conductive metal is silver and employs a high surface area material in order to improve fine line printing. The organic system makes use of highly soluble binder materials to enable higher loading of the total resin in the paste that improves the printability and print qualities of fine lines. The improved solubility also broadens the range of thixotropes that can be used to further improve printed line properties. In the organic system, a high surface tension solvent is used to improve line quality metrics such as 'aspect ratio'. The inorganic glass and additives include compounds of lead, tellurium and thallium that improve the electrode contact to, and light conversion efficiency of, the silicon solar cell.