SEMICONDUCTOR DEVICE PRODUCTION COMPOSITION AND PATTERN FORMATION METHOD

Provided is a semiconductor device production composition that has superior embedding properties into a pattern wafer, and that can achieve a reduction in membrane stress. The semiconductor device production composition contains the product obtained by mixing a metal compound and hydrogen peroxide i...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Sakai Tatsuya, Saitou Ryuichi, Kurita Shunsuke, NAKAGAWA Hisashi
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a semiconductor device production composition that has superior embedding properties into a pattern wafer, and that can achieve a reduction in membrane stress. The semiconductor device production composition contains the product obtained by mixing a metal compound and hydrogen peroxide in an organic solvent [I], and an organic solvent [II]. The semiconductor device production composition has superior embedding properties into a pattern wafer, and furthermore can reduce membrane stress when forming a pattern by means of a multi-layer resist process.