CONDUCTIVE ADHESIVE AND BONDING METHOD OF COMPOSITE MATERIAL USING THE CONDUCTIVE ADHESIVE

A conductive adhesive includes an adhesive of 80 to 90 wt % and a conductive fiber of 10 to 20 wt %. The conductive adhesive according to the present disclosure has excellent conductivity by mixing the conductive fiber with the one-component adhesive or the two-component adhesive to make electric co...

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Hauptverfasser: CHOI Young Ho, KIM Seok Hwan, JEONG Kie Youn
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creator CHOI Young Ho
KIM Seok Hwan
JEONG Kie Youn
description A conductive adhesive includes an adhesive of 80 to 90 wt % and a conductive fiber of 10 to 20 wt %. The conductive adhesive according to the present disclosure has excellent conductivity by mixing the conductive fiber with the one-component adhesive or the two-component adhesive to make electric conduction smoother, and to improve adhesion properties and durability regarding temperature changes.
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
title CONDUCTIVE ADHESIVE AND BONDING METHOD OF COMPOSITE MATERIAL USING THE CONDUCTIVE ADHESIVE
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