CONDUCTIVE ADHESIVE AND BONDING METHOD OF COMPOSITE MATERIAL USING THE CONDUCTIVE ADHESIVE

CONDUCTIVE ADHESIVE AND BONDING METHOD OF COMPOSITE MATERIAL USING THE CONDUCTIVE ADHESIVE

A conductive adhesive includes an adhesive of 80 to 90 wt % and a conductive fiber of 10 to 20 wt %. The conductive adhesive according to the present disclosure has excellent conductivity by mixing the conductive fiber with the one-component adhesive or the two-component adhesive to make electric co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHOI Young Ho, KIM Seok Hwan, JEONG Kie Youn
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:A conductive adhesive includes an adhesive of 80 to 90 wt % and a conductive fiber of 10 to 20 wt %. The conductive adhesive according to the present disclosure has excellent conductivity by mixing the conductive fiber with the one-component adhesive or the two-component adhesive to make electric conduction smoother, and to improve adhesion properties and durability regarding temperature changes.