ELECTRONIC DEVICE INCLUDING A METAL SUBSTRATE AND A SEMICONDUCTOR MODULE EMBEDDED IN A LAMINATE

ELECTRONIC DEVICE INCLUDING A METAL SUBSTRATE AND A SEMICONDUCTOR MODULE EMBEDDED IN A LAMINATE

An electronic device having a substrate including a metal layer, an electrically insulating layer disposed above the substrate, a semiconductor module disposed above the electrically insulating layer and a lamination layer disposed above the electrically insulating layer. The lamination layer at lea...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Dinkel Markus
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device having a substrate including a metal layer, an electrically insulating layer disposed above the substrate, a semiconductor module disposed above the electrically insulating layer and a lamination layer disposed above the electrically insulating layer. The lamination layer at least partially embeds the semiconductor module.