CONDUCTIVE PASTE AND CONDUCTIVE FILM

Provided is a conductive paste containing: a binder resin containing at least an aromatic polyimide resin (A) having a phenolic hydroxyl group and an ether linkage in a skeleton, and conductive particles. The polyimide resin (A) is preferably the resin of formula (1). (R1 represents formula (2), R2...

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Bibliographische Detailangaben
Hauptverfasser:	SEGAWA Junichi, ISHIKAWA Kazunori, MIZUTANI Go
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	Provided is a conductive paste containing: a binder resin containing at least an aromatic polyimide resin (A) having a phenolic hydroxyl group and an ether linkage in a skeleton, and conductive particles. The polyimide resin (A) is preferably the resin of formula (1). (R1 represents formula (2), R2 represents formula (3), and R3 represents a divalent aromatic group having at least one of the structures illustrated in formula (4).