REAR SURFACE-PROTECTIVE FILM FOR PROTECTING REAR SURFACE OF SEMICONDUCTOR ELEMENT, INTEGRATED FILM, FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING CHIP

Disclosed is a rear surface-protective film making it possible to watch, across this rear surface-protective film, a crack of a semiconductor element through an infrared camera, and the like. is the invention relates to a rear surface-protective film for protecting a rear surface of a semiconductor...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKAMOTO Naohide, KIMURA Ryuichi
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Disclosed is a rear surface-protective film making it possible to watch, across this rear surface-protective film, a crack of a semiconductor element through an infrared camera, and the like. is the invention relates to a rear surface-protective film for protecting a rear surface of a semiconductor element, the film having a parallel light transmittance of 15% or more at a wavelength of 800 nm. The ratio of the parallel light transmittance at a wavelength of 800 nm to the parallel light transmittance at a wavelength of 532 nm in the rear surface-protective film is preferably 2 or more.