METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

A method for fabricating a semiconductor device includes: forming a metal pattern including nickel on a semiconductor layer, the metal pattern having upper and side surfaces; forming a mask pattern having an opening in which upper and side surfaces of the metal pattern therein being exposed; forming...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Nishizawa Shuichi
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method for fabricating a semiconductor device includes: forming a metal pattern including nickel on a semiconductor layer, the metal pattern having upper and side surfaces; forming a mask pattern having an opening in which upper and side surfaces of the metal pattern therein being exposed; forming a barrier layer on the metal pattern exposed in the opening by a plating method; and forming a conducting layer on the barrier layer exposed in the opening.