EXTERIOR FORMING METHOD AND EXTERIOR FORMING STRUCTURE OF ELECTRONIC COMPONENT

Disclosed herein are an exterior forming method and an exterior forming structure of an electronic component. The exterior forming method of an electronic component may include mounting an injection-molded product, which is injection molded as an electronic component, to an upper portion a heat tran...

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Bibliographische Detailangaben
Hauptverfasser:	YOUN Dae-Keun, YOON Sung Woon, KIM Hui-Cheol, LEE Kyo Ree, LEE Sung-Hai
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING DECORATIVE ARTS MOSAICS PAPERHANGING PERFORMING OPERATIONS PRODUCING DECORATIVE EFFECTS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TARSIA WORK TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Disclosed herein are an exterior forming method and an exterior forming structure of an electronic component. The exterior forming method of an electronic component may include mounting an injection-molded product, which is injection molded as an electronic component, to an upper portion a heat transferring base unit, mounting a printing film having an ink layer for a heat transfer to the upper portion of the heat transferring base unit such that the ink layer faces an upper surface of the injection-molded product, and heat-transferring the ink layer on the upper surface of the injection-molded product by rotating a heating roll while closely attached at an upper portion of the printing film. The exterior forming method may also include forming an UV coating layer on an upper portion of the ink layer that is heat-transferred on the injection-molded product.