Tin-Antimony-Based High Temperature Solder for Downhole Components

A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the down-hole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6...

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Bibliographische Detailangaben
Hauptverfasser: Dupouy Francis, Kostinovsky Mark, Patel Chandradip Pravinbhai, Kleitz Suriyakan Vongtragool
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the down-hole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6 to 10.2 weight % of antimony; from 0.01 to 0.25 weight % of manganese; and tin.