SYSTEM WITH STEPPED THREE DIMENSIONAL PROFILE AND VENTING

SYSTEM WITH STEPPED THREE DIMENSIONAL PROFILE AND VENTING

A system and method are provided that comprise a circuit board including one or more processors and a chassis that holds the circuit board. The chassis includes a card receptacle that receives an electronics card. The electronics card comprises a card circuit board having electronic components inclu...

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Hauptverfasser: Junkins Andrew Thomas, Samper Rodrigo, Artman Paul
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator Junkins Andrew Thomas
Samper Rodrigo
Artman Paul
description A system and method are provided that comprise a circuit board including one or more processors and a chassis that holds the circuit board. The chassis includes a card receptacle that receives an electronics card. The electronics card comprises a card circuit board having electronic components including one or more processors. The card circuit board has a chassis loading end. A heat sink is provided on the circuit board and thermally coupled to one or more electronic components to dissipate heat therefrom. The heat sink has a three-dimensional envelope having a stepped end profile relative to the chassis loading end. Vent openings are provided in shielding of the electronics card for airflow from the electronics card.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SYSTEM WITH STEPPED THREE DIMENSIONAL PROFILE AND VENTING
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