SYSTEM WITH STEPPED THREE DIMENSIONAL PROFILE AND VENTING

A system and method are provided that comprise a circuit board including one or more processors and a chassis that holds the circuit board. The chassis includes a card receptacle that receives an electronics card. The electronics card comprises a card circuit board having electronic components inclu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Junkins Andrew Thomas, Samper Rodrigo, Artman Paul
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A system and method are provided that comprise a circuit board including one or more processors and a chassis that holds the circuit board. The chassis includes a card receptacle that receives an electronics card. The electronics card comprises a card circuit board having electronic components including one or more processors. The card circuit board has a chassis loading end. A heat sink is provided on the circuit board and thermally coupled to one or more electronic components to dissipate heat therefrom. The heat sink has a three-dimensional envelope having a stepped end profile relative to the chassis loading end. Vent openings are provided in shielding of the electronics card for airflow from the electronics card.