PREDICTING PROCESS FAIL LIMITS

In an approach for predicting a process fail limit for a semiconductor manufacturing process, a computer determines a potential working process condition for each of a plurality of process parameters varied in forming a test wafer feature. The computer determines a process sigma value for each of th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Viswanathan Ramya, Mansfield Scott M, Han Geng
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS PHYSICS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	In an approach for predicting a process fail limit for a semiconductor manufacturing process, a computer determines a potential working process condition for each of a plurality of process parameters varied in forming a test wafer feature. The computer determines a process sigma value for each of the plurality of process parameters in forming the test wafer feature and a measurement sigma value. The computer evaluates a set of measurements of the test wafer feature compared to an acceptable wafer feature dimension, where each measurement of the set of measurements is a pass or fail as compared to the acceptable wafer feature dimension. The computer determines whether one or more fails are evaluated compared to the acceptable wafer feature dimension. The computer produces a predicted process fail limit based, at least in part, on the evaluation of fails, the measurement sigma value, and a desired target sigma value.