Stripping Solution for Zinc/Nickel Alloy Plating from Metal Substrate

The present disclosure relates generally to the field of electroplating and electroless plating. More specifically, the present disclosure relates to plating solutions and plating removal/stripping solutions for stripping zinc/nickel alloy plating from substrates.

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Bibliographische Detailangaben
1. Verfasser: LAWLESS LAWRENCE M
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure relates generally to the field of electroplating and electroless plating. More specifically, the present disclosure relates to plating solutions and plating removal/stripping solutions for stripping zinc/nickel alloy plating from substrates.