CURED PRODUCT OF POLYPHENYLENE ETHER-CONTAINING RESIN COMPOSITION

The description of the present application describes a cured product that is obtained by compression molding a resin composition that contains a polyphenylene ether (A) and a cross-linking curable compound (B). A phase separated structure that comprises a dispersed phase and a continuous phase is ob...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OTANI Shoji, ENDO Masaaki
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The description of the present application describes a cured product that is obtained by compression molding a resin composition that contains a polyphenylene ether (A) and a cross-linking curable compound (B). A phase separated structure that comprises a dispersed phase and a continuous phase is observed in a 10,000× morphological image that is observed from the vertical direction of a compression surface of the cured product using a transmission electron microscope. In a 200,000× morphological image that is observed from the vertical direction of the compression surface of the cured product using a transmission electron microscope, the continuous phase has a co-continuous structure that includes an A phase that has the polyphenylene ether (A) as a principal component and a B phase that has the cross-linking curable compound (B) as a principal component, the proportion of the area of the co-continuous structure occupied by the A phase being 40%-90% of the area.