LEAD FRAME FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME

A lead frame for mounting semiconductor element includes a protrusion that is horizontally projects from edges of the upper and lower surfaces of a semiconductor-mounting part or a terminal part of the lead frame and that is provided on a lateral side of at least one of the semiconductor-mounting pa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMASHITA Ryohei, YOSHIMOTO Ryouichi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A lead frame for mounting semiconductor element includes a protrusion that is horizontally projects from edges of the upper and lower surfaces of a semiconductor-mounting part or a terminal part of the lead frame and that is provided on a lateral side of at least one of the semiconductor-mounting part or the terminal part of the lead frame, wherein the top end of the protrusion is substantially flat or the profile of the cross section of the top end is arc-shaped, and the top end of the protrusion is thick.