NITROGEN OXIDE ABATEMENT IN SEMICONDUCTOR FABRICATION

Embodiments enclosed herein relate to methods and apparatus for reducing nitrogen oxides (NOx) produced during processing, such as during semiconductor fabrication processing. A processing system may include an abatement controller and an effluent abatement system, wherein the abatement controller c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Dickinson Colin John, Fisher Paul E, Herbert Andrew, McIntosh Monique
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Embodiments enclosed herein relate to methods and apparatus for reducing nitrogen oxides (NOx) produced during processing, such as during semiconductor fabrication processing. A processing system may include an abatement controller and an effluent abatement system, wherein the abatement controller controls the effluent abatement system to reduce NOx production, while ensuring abatement of the effluent gases from the processing system. The effluent abatement system may include a combustion-type effluent abatement system and/or a plasma-type effluent abatement system. The abatement controller may select operating modes of the effluent abatement systems to reduce NOx production.