TAPE-SUBSTRATE COATING LINE HAVING A MAGNETRON ARRANGEMENT

A tape-substrate coating line has a vacuum chamber formed by chamber walls and a device, disposed in the vacuum chamber, for surface treatment of a tape substrate. The device includes a process temperature-control roller having a cylindrical lateral face. At least one part-circumference of the later...

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Bibliographische Detailangaben
Hauptverfasser:	DASSLER Andreas, PROEHL Holger, HENTSCHEL Michael, MUELLER Andreas, KAISER Christoph
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A tape-substrate coating line has a vacuum chamber formed by chamber walls and a device, disposed in the vacuum chamber, for surface treatment of a tape substrate. The device includes a process temperature-control roller having a cylindrical lateral face. At least one part-circumference of the lateral face is enclosed by a processing space which has an arrangement of compartments delimited by separation wall elements. At least one coating installation is disposed in at least one compartment, and includes a conveying installation for conveying the tape substrate over the lateral face. The size, number and arrangement of the compartments are variable in that each separation wall element is attachable to one of a plurality of predefined positions within the processing space.