HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Osborn Tyler N Bekar Ibrahim Mirpuri Kabirkumar J Sidhu Rajen S Jadhav Susheel G Jiang Hongjin |
| description | Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2016260679A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2016260679A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2016260679A13</originalsourceid><addsrcrecordid>eNrjZNDziHQK8nRR8PQLcQ1y9vfzc3UOUXDzD1Lw8Q9XCHH1DXANcgwJDXJVcAwJcXT24GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGZkZmBmbmlo6GxsSpAgCN5Cbh</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH</title><source>esp@cenet</source><creator>Osborn Tyler N ; Bekar Ibrahim ; Mirpuri Kabirkumar J ; Sidhu Rajen S ; Jadhav Susheel G ; Jiang Hongjin</creator><creatorcontrib>Osborn Tyler N ; Bekar Ibrahim ; Mirpuri Kabirkumar J ; Sidhu Rajen S ; Jadhav Susheel G ; Jiang Hongjin</creatorcontrib><description>Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160908&DB=EPODOC&CC=US&NR=2016260679A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160908&DB=EPODOC&CC=US&NR=2016260679A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Osborn Tyler N</creatorcontrib><creatorcontrib>Bekar Ibrahim</creatorcontrib><creatorcontrib>Mirpuri Kabirkumar J</creatorcontrib><creatorcontrib>Sidhu Rajen S</creatorcontrib><creatorcontrib>Jadhav Susheel G</creatorcontrib><creatorcontrib>Jiang Hongjin</creatorcontrib><title>HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH</title><description>Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDziHQK8nRR8PQLcQ1y9vfzc3UOUXDzD1Lw8Q9XCHH1DXANcgwJDXJVcAwJcXT24GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGZkZmBmbmlo6GxsSpAgCN5Cbh</recordid><startdate>20160908</startdate><enddate>20160908</enddate><creator>Osborn Tyler N</creator><creator>Bekar Ibrahim</creator><creator>Mirpuri Kabirkumar J</creator><creator>Sidhu Rajen S</creator><creator>Jadhav Susheel G</creator><creator>Jiang Hongjin</creator><scope>EVB</scope></search><sort><creationdate>20160908</creationdate><title>HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH</title><author>Osborn Tyler N ; Bekar Ibrahim ; Mirpuri Kabirkumar J ; Sidhu Rajen S ; Jadhav Susheel G ; Jiang Hongjin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016260679A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Osborn Tyler N</creatorcontrib><creatorcontrib>Bekar Ibrahim</creatorcontrib><creatorcontrib>Mirpuri Kabirkumar J</creatorcontrib><creatorcontrib>Sidhu Rajen S</creatorcontrib><creatorcontrib>Jadhav Susheel G</creatorcontrib><creatorcontrib>Jiang Hongjin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Osborn Tyler N</au><au>Bekar Ibrahim</au><au>Mirpuri Kabirkumar J</au><au>Sidhu Rajen S</au><au>Jadhav Susheel G</au><au>Jiang Hongjin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH</title><date>2016-09-08</date><risdate>2016</risdate><abstract>Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2016260679A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T23%3A46%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Osborn%20Tyler%20N&rft.date=2016-09-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2016260679A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |