HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH

HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH

Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Osborn Tyler N, Bekar Ibrahim, Mirpuri Kabirkumar J, Sidhu Rajen S, Jadhav Susheel G, Jiang Hongjin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.