SOLID-STATE IMAGING DEVICE, IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURING METHOD

A solid-state imaging device includes a plurality of substrates provided to be overlapped and a connection structure. Each of the substrates includes a semiconductor layer in which a photoelectric conversion unit configured to convert incident light to a signal is formed, and an interconnection layer in which an interconnection configured to transmit the signal is formed and which overlaps the semiconductor layer. The semiconductor layer of a first substrate and the interconnection layer of a second substrate in two adjacent substrates among the plurality of substrates are disposed to face each other. The connection structure electrically connects the interconnection layer of the first substrate and the interconnection layer of the second substrate, and passes through only the semiconductor layer of the first substrate out of the semiconductor layer of the first substrate and the interconnection layer of the second substrate.