METHODS FOR FABRICATING SEMICONDUCTOR STRUCTURE WITH CONDENSED SILICON GERMANIUM LAYER
Methods of forming condensed first layer and semiconductor structures formed from the methods are provided. The methods include, for instance providing at least one layer disposed over a substrate structure of a semiconductor structure, wherein the substrate structure includes an upper silicon regio...
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creator | CHILD Amy Lynn TRIYOSO Dina H SHI Haoran WAHL Jeremy Austin TONG Wei Hua |
description | Methods of forming condensed first layer and semiconductor structures formed from the methods are provided. The methods include, for instance providing at least one layer disposed over a substrate structure of a semiconductor structure, wherein the substrate structure includes an upper silicon region; and performing at least one oxidation process of the semiconductor structure, the at least one oxidation process reducing a thickness of the upper region, wherein the performing facilitates diffusing to form a condensed layer over the substrate structure. |
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The methods include, for instance providing at least one layer disposed over a substrate structure of a semiconductor structure, wherein the substrate structure includes an upper silicon region; and performing at least one oxidation process of the semiconductor structure, the at least one oxidation process reducing a thickness of the upper region, wherein the performing facilitates diffusing to form a condensed layer over the substrate structure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160901&DB=EPODOC&CC=US&NR=2016254145A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160901&DB=EPODOC&CC=US&NR=2016254145A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHILD Amy Lynn</creatorcontrib><creatorcontrib>TRIYOSO Dina H</creatorcontrib><creatorcontrib>SHI Haoran</creatorcontrib><creatorcontrib>WAHL Jeremy Austin</creatorcontrib><creatorcontrib>TONG Wei Hua</creatorcontrib><title>METHODS FOR FABRICATING SEMICONDUCTOR STRUCTURE WITH CONDENSED SILICON GERMANIUM LAYER</title><description>Methods of forming condensed first layer and semiconductor structures formed from the methods are provided. 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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | METHODS FOR FABRICATING SEMICONDUCTOR STRUCTURE WITH CONDENSED SILICON GERMANIUM LAYER |
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