METHODS FOR FABRICATING SEMICONDUCTOR STRUCTURE WITH CONDENSED SILICON GERMANIUM LAYER

Methods of forming condensed first layer and semiconductor structures formed from the methods are provided. The methods include, for instance providing at least one layer disposed over a substrate structure of a semiconductor structure, wherein the substrate structure includes an upper silicon regio...

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Hauptverfasser: CHILD Amy Lynn, TRIYOSO Dina H, SHI Haoran, WAHL Jeremy Austin, TONG Wei Hua
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creator CHILD Amy Lynn
TRIYOSO Dina H
SHI Haoran
WAHL Jeremy Austin
TONG Wei Hua
description Methods of forming condensed first layer and semiconductor structures formed from the methods are provided. The methods include, for instance providing at least one layer disposed over a substrate structure of a semiconductor structure, wherein the substrate structure includes an upper silicon region; and performing at least one oxidation process of the semiconductor structure, the at least one oxidation process reducing a thickness of the upper region, wherein the performing facilitates diffusing to form a condensed layer over the substrate structure.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2016254145A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2016254145A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2016254145A13</originalsourceid><addsrcrecordid>eNqNirEKwjAUALM4iPoPD5wFU9vuMX1pAk0CL4niVIrESbRQ_x9b8AOc7uBuzS4Wo_ZNAOUJlDiTkSIa10JAa6R3TZJxLiHSLIkQriZqWAK6gA0E0y0btEhWOJMsdOKGtGWrx_Cc8u7HDdsrjFIf8vju8zQO9_zKnz6F4sjroip5WQl--u_6ApFOMhQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHODS FOR FABRICATING SEMICONDUCTOR STRUCTURE WITH CONDENSED SILICON GERMANIUM LAYER</title><source>esp@cenet</source><creator>CHILD Amy Lynn ; TRIYOSO Dina H ; SHI Haoran ; WAHL Jeremy Austin ; TONG Wei Hua</creator><creatorcontrib>CHILD Amy Lynn ; TRIYOSO Dina H ; SHI Haoran ; WAHL Jeremy Austin ; TONG Wei Hua</creatorcontrib><description>Methods of forming condensed first layer and semiconductor structures formed from the methods are provided. The methods include, for instance providing at least one layer disposed over a substrate structure of a semiconductor structure, wherein the substrate structure includes an upper silicon region; and performing at least one oxidation process of the semiconductor structure, the at least one oxidation process reducing a thickness of the upper region, wherein the performing facilitates diffusing to form a condensed layer over the substrate structure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160901&amp;DB=EPODOC&amp;CC=US&amp;NR=2016254145A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160901&amp;DB=EPODOC&amp;CC=US&amp;NR=2016254145A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHILD Amy Lynn</creatorcontrib><creatorcontrib>TRIYOSO Dina H</creatorcontrib><creatorcontrib>SHI Haoran</creatorcontrib><creatorcontrib>WAHL Jeremy Austin</creatorcontrib><creatorcontrib>TONG Wei Hua</creatorcontrib><title>METHODS FOR FABRICATING SEMICONDUCTOR STRUCTURE WITH CONDENSED SILICON GERMANIUM LAYER</title><description>Methods of forming condensed first layer and semiconductor structures formed from the methods are provided. The methods include, for instance providing at least one layer disposed over a substrate structure of a semiconductor structure, wherein the substrate structure includes an upper silicon region; and performing at least one oxidation process of the semiconductor structure, the at least one oxidation process reducing a thickness of the upper region, wherein the performing facilitates diffusing to form a condensed layer over the substrate structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNirEKwjAUALM4iPoPD5wFU9vuMX1pAk0CL4niVIrESbRQ_x9b8AOc7uBuzS4Wo_ZNAOUJlDiTkSIa10JAa6R3TZJxLiHSLIkQriZqWAK6gA0E0y0btEhWOJMsdOKGtGWrx_Cc8u7HDdsrjFIf8vju8zQO9_zKnz6F4sjroip5WQl--u_6ApFOMhQ</recordid><startdate>20160901</startdate><enddate>20160901</enddate><creator>CHILD Amy Lynn</creator><creator>TRIYOSO Dina H</creator><creator>SHI Haoran</creator><creator>WAHL Jeremy Austin</creator><creator>TONG Wei Hua</creator><scope>EVB</scope></search><sort><creationdate>20160901</creationdate><title>METHODS FOR FABRICATING SEMICONDUCTOR STRUCTURE WITH CONDENSED SILICON GERMANIUM LAYER</title><author>CHILD Amy Lynn ; TRIYOSO Dina H ; SHI Haoran ; WAHL Jeremy Austin ; TONG Wei Hua</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016254145A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHILD Amy Lynn</creatorcontrib><creatorcontrib>TRIYOSO Dina H</creatorcontrib><creatorcontrib>SHI Haoran</creatorcontrib><creatorcontrib>WAHL Jeremy Austin</creatorcontrib><creatorcontrib>TONG Wei Hua</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHILD Amy Lynn</au><au>TRIYOSO Dina H</au><au>SHI Haoran</au><au>WAHL Jeremy Austin</au><au>TONG Wei Hua</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHODS FOR FABRICATING SEMICONDUCTOR STRUCTURE WITH CONDENSED SILICON GERMANIUM LAYER</title><date>2016-09-01</date><risdate>2016</risdate><abstract>Methods of forming condensed first layer and semiconductor structures formed from the methods are provided. The methods include, for instance providing at least one layer disposed over a substrate structure of a semiconductor structure, wherein the substrate structure includes an upper silicon region; and performing at least one oxidation process of the semiconductor structure, the at least one oxidation process reducing a thickness of the upper region, wherein the performing facilitates diffusing to form a condensed layer over the substrate structure.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHODS FOR FABRICATING SEMICONDUCTOR STRUCTURE WITH CONDENSED SILICON GERMANIUM LAYER
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-20T21%3A56%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHILD%20Amy%20Lynn&rft.date=2016-09-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2016254145A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true