METHODS FOR IMPROVING ADHESION ON DIELECTRIC SUBSTRATES

Various embodiments described herein provide for substrate structures including uniform plating seed layers, and that provide favorable adhesion on dielectric substrate layers. According to some embodiments, a methods for forming a magnetic recording pole is provided comprising: forming an insulator layer; forming a trench in the insulator layer; forming an amorphous seed layer over the insulator layer; forming an adhesion layer over the amorphous seed layer, the adhesion layer comprising a physical vapor deposited (PVD) noble metal; forming a plating seed layer over the adhesion layer, the plating seed layer comprising chemical vapor deposited (CVD) Ru; and forming a magnetic material layer over the plating seed layer.