SUBSTRATE DETACHING APPARATUS

The present invention aims at reducing a breaking phenomenon of an adsorbed substrate while the substrate is detached from a lower plate at a high speed. An embodiment is a substrate detaching apparatus including an adsorption main body disposed on one side of the adsorbed substrate to generate an a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BAEK Seung-Jin, CHOI Hyun Hwan, PARK Myung Hwan, NA Man Hong, JO Kun Hee
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention aims at reducing a breaking phenomenon of an adsorbed substrate while the substrate is detached from a lower plate at a high speed. An embodiment is a substrate detaching apparatus including an adsorption main body disposed on one side of the adsorbed substrate to generate an adsorption force; and a plurality of adsorption parts provided in a predetermined adsorption region of the substrate under the adsorption main body, being spaced apart from each other and applied with an adsorption force from the adsorption main body to adsorb the substrate, wherein the adsorption region includes an outer region of a first cycloid curved line protruding in a third corner direction based on a diagonal connecting between a first corner and a second corner of the adsorbed substrate and an outer region of a second cycloid curved line protruding in a fourth corner direction.