Multi-Chip Structure and Method of Forming Same

Multi-Chip Structure and Method of Forming Same

A device comprises a first chip and a second chip stacked together to form a multi-chip structure, wherein the multi-chip structure is embedded in an encapsulation layer, and wherein at least one edge of the first chip and the second chip is exposed outside the encapsulation layer, a redistribution...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YU CHEN-HUA, YEH DERYANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A device comprises a first chip and a second chip stacked together to form a multi-chip structure, wherein the multi-chip structure is embedded in an encapsulation layer, and wherein at least one edge of the first chip and the second chip is exposed outside the encapsulation layer, a redistribution layer on a surface of a first side of the encapsulation layer and a plurality of conductive bumps over the redistribution layer and connected to the redistribution layer.