Electrically Conductive Joining Agent and Solder Joint

This invention has an object to provide an electrically conductive joining agent which enables a thermosetting resin to cure in a short time. It contains electrically conductive metallic powder including Sn of 40% or more, thermosetting resin, an acid-anhydride-based hardening agent and an organic a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MIZOWAKI TOSHIO, TAKAGI YOSHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASTING CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	This invention has an object to provide an electrically conductive joining agent which enables a thermosetting resin to cure in a short time. It contains electrically conductive metallic powder including Sn of 40% or more, thermosetting resin, an acid-anhydride-based hardening agent and an organic acid. The electrically conductive metallic powder and the organic acid are reacted during a heating process to produce an organic acid metal salt which is used as hardening accelerator. It enables thermosetting resin to cure in a short time, for example, a time equivalent to a time that is required for the general reflow process.