POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE

[Object] It is intended to obtain a polyamide resin composition that is excellent in heat aging resistance and exhibits suppressed metal corrosive properties and copper-depositing properties. [Means of Solving the Problems] A polyamide resin composition including a polyamide resin (A), a copper comp...

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Bibliographische Detailangaben
Hauptverfasser:	SAKUMA TERUAKI, TERADA KAZUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	[Object] It is intended to obtain a polyamide resin composition that is excellent in heat aging resistance and exhibits suppressed metal corrosive properties and copper-depositing properties. [Means of Solving the Problems] A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and a secondary amine compound (D).