PACKAGE

The present disclosure relates to a package including a floor and a side wall extending upwardly from the floor. The package is configured to receive a high-temperature fluid during a container-filling activity at a container-filling factory.

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Bibliographische Detailangaben
Hauptverfasser: BRUCHMAN JOSEPH J, GORDON JERRY, GUTEKUNST BRADY, ANKNEY DONALD H
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present disclosure relates to a package including a floor and a side wall extending upwardly from the floor. The package is configured to receive a high-temperature fluid during a container-filling activity at a container-filling factory.