PACKAGE
The present disclosure relates to a package including a floor and a side wall extending upwardly from the floor. The package is configured to receive a high-temperature fluid during a container-filling activity at a container-filling factory.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present disclosure relates to a package including a floor and a side wall extending upwardly from the floor. The package is configured to receive a high-temperature fluid during a container-filling activity at a container-filling factory. |
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