POWER HEAT DISSIPATION DEVICE AND METHOD FOR CONTROLLING THE SAME

A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one thermoelectric cooling chip. The heat-conducting layer has a heat-absorbing-surface and a heat-dissipating-surface which are opposite to each other. The heat sink is in thermal contact with the heat-dissip...

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Bibliographische Detailangaben
Hauptverfasser:	LIN KOU-TZENG, CHIANG WEN-SHU, HWANG CHIH-YU, CHANG PO-HUA, WU MINUAN
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-PROPELLEDVEHICLES ELECTRICITY ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES, IN GENERAL MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES PERFORMING OPERATIONS TRANSPORTING VEHICLES IN GENERAL
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Beschreibung
Zusammenfassung:	A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one thermoelectric cooling chip. The heat-conducting layer has a heat-absorbing-surface and a heat-dissipating-surface which are opposite to each other. The heat sink is in thermal contact with the heat-dissipating-surface of the heat-conducting layer. The at least one thermoelectric cooling chip is embedded in the heat-conducting layer. The heat-conducting layer has an effective heat-conducting-region. A1 is the area on the heat-absorbing-surface which the effective heat-conducting-region projects on, and A2 is the area on the heat-absorbing-surface which the thermoelectric cooling chip projects on. The ratio of A2 to A1 is between 0.15 and 0.58.