MODULAR HEAT SINK

A modular heat dissipation assembly (2) used for a light emitting device (100) is presented. It comprises a base (22), which comprises a first number of arrangements (23), for thermally coupling to a light source (31) of the light emitting device (100); and a second number of heat conducting element...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LIAO HUAIZHOU, LIN LIHUA
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	A modular heat dissipation assembly (2) used for a light emitting device (100) is presented. It comprises a base (22), which comprises a first number of arrangements (23), for thermally coupling to a light source (31) of the light emitting device (100); and a second number of heat conducting elements (21) which are attached to the base (22) via the arrangements (23), and the second number varies from zero to a maximum equal to the first number, so that a thermal capacity of the modular heat dissipation assembly matches a predetermined thermal load of the light emitting device. In one aspect, configurations to maintain a chimney effect with the modular heat dissipation assembly are presented. A luminaire comprising such a heat dissipation assembly and the manufacturing method for the heat dissipation assembly are also presented.