OPTICAL MEMBER WITH IN-SITU-FORMED GASKET AND METHOD OF MANUFACTURE

An LED light fixture including a mounting surface which supports a circuit board with at least one LED light source spaced thereon, and an optical member which has a back side having a groove facing the mounting surface and surrounding the circuit board. The groove is filled with a resilient in-situ...

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Bibliographische Detailangaben
Hauptverfasser:	KINNUNE BRIAN, GOELZ DAVE
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO USESOR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR TRANSPORTING WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An LED light fixture including a mounting surface which supports a circuit board with at least one LED light source spaced thereon, and an optical member which has a back side having a groove facing the mounting surface and surrounding the circuit board. The groove is filled with a resilient in-situ-formed compressible gasket material sealingly engaged with the mounting surface to environmentally seal the circuit board. The mounting surface may be of a heat-sink structure. The in-situ-formed gasket has an inner edge and a plurality of inward projections spaced therealong. Each inward projection extends inwardly to a position facing the circuit board and presses the circuit board against the mounting surface, thereby facilitating heat transfer away from the circuit board.