MULTI-CHIP PACKAGED FUNCTION INCLUDING A PROGRAMMABLE DEVICE AND A FIXED FUNCTION DIE AND USE FOR APPLICATION ACCELERATION

One or more processing functions may be off-loaded from a general-purpose processing device to auxiliary processing devices. The auxiliary processing devices may include a programmable element and a fixed-function element that may be pre-configured to perform the one or more processing functions. Th...

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Bibliographische Detailangaben
Hauptverfasser:	VASISHTA RONNIE, WONG BAN P
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS PHYSICS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	One or more processing functions may be off-loaded from a general-purpose processing device to auxiliary processing devices. The auxiliary processing devices may include a programmable element and a fixed-function element that may be pre-configured to perform the one or more processing functions. The programmable element and the fixed-function element may be dies of a multi-chip module (MOM) in a common package that can contain the general-purpose processing device, or the general-purpose processing device may reside outside of the MOM.