Thermal Management In Electronic Apparatus With Phase-Change Material And Silicon Heat Sink

Embodiments of an apparatus with a thermal management technique utilizing a silicon heat sink and/or a phase-change material, as well as an assembling method thereof, are described. In one aspect, the apparatus comprises a main unit, a phase-change material and an enclosure enclosing the main unit a...

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Bibliographische Detailangaben
1. Verfasser:	KIM GERALD HO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Embodiments of an apparatus with a thermal management technique utilizing a silicon heat sink and/or a phase-change material, as well as an assembling method thereof, are described. In one aspect, the apparatus comprises a main unit, a phase-change material and an enclosure enclosing the main unit and the phase-change material. The main unit comprises a substrate and at least one heat-generating device disposed on the substrate. The phase-change material is in direct contact with each heat-generating device of the at least one heat-generating device to absorb and dissipate heat generated by the at least one heat-generating device.