PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

The present invention provides a printed circuit board includes an insulating member, a first plating layer buried in a bottom region of the insulating member, a second plating layer buried in a top region of the insulating member and a plating via for electrically connecting the first plating layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IM SE RANG, KWON KWANG HEE, LEE YOUNG KWAN, CHUNG YUL KYO, SUNG KI JUNG, HWANG JUN OH, LEE SEUNG EUN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention provides a printed circuit board includes an insulating member, a first plating layer buried in a bottom region of the insulating member, a second plating layer buried in a top region of the insulating member and a plating via for electrically connecting the first plating layer and the second plating layer by being buried in any one among the top region and the bottom region of the insulating member.