Diamond Abrasive Recovery Method

A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon. The method comprises (1) recovering polishing material slurry including the used diamond abrasive; (2)...

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Bibliographische Detailangaben
Hauptverfasser:	MAEZAWA AKIHIRO, NAGAI YUUKI, INUI CHIE
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POLISHING SEPARATION TRANSPORTING TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
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Beschreibung
Zusammenfassung:	A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon. The method comprises (1) recovering polishing material slurry including the used diamond abrasive; (2) adding inorganic salt including a metallic element which is to be a divalent or trivalent cation to the recovered polishing material slurry to aggregate the diamond abrasive and separating a supernatant liquid from a diamond abrasive included dispersion medium; and (3) extracting diamond abrasive from the separated diamond abrasive included dispersion medium using a low polarity dispersion medium.