SEMICONDUCTOR MANUFACTURING EQUIPMENT COMPONENT AND METHOD OF MAKING THE SAME

A method of making a semiconductor manufacturing equipment component, such as an electrostatic chuck, includes an application step of applying a photosensitive metal paste onto a ceramic green sheet, which is to become the body substrate, the photosensitive metal paste being a heating element materi...

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Bibliographische Detailangaben
Hauptverfasser:	NIWA TOMONORI, KIBE TAICHI, NASU TAKAKUNI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A method of making a semiconductor manufacturing equipment component, such as an electrostatic chuck, includes an application step of applying a photosensitive metal paste onto a ceramic green sheet, which is to become the body substrate, the photosensitive metal paste being a heating element material; an exposure-and-development step of exposing the photosensitive metal paste, which has been applied onto the ceramic green sheet, to light and developing the photosensitive metal paste to form an intermediate heating element, which is to become the heating element, on the ceramic green sheet; and a firing step of co-firing the ceramic green sheet and the intermediate heating element to form the body substrate and the heating element.