Modular Shoe Sole Assembly for High Heels

A shoe sole assembly for increasing a bottom surface area of a high heel shoe that includes a toe portion and a heel shaft having a bottom tip includes a sole member having opposed front and rear ends that define a generally planar surface therebetween. A heel receiving member is situated on an upper surface of the sole member adjacent the rear end in selective receipt of the bottom tip of the heel shaft of the high heel shoe. A toe securement member is coupled to the sole member adjacent the front end having a shape configuration in selective receipt of the toe portion of the high heel shoe.